Double-flip transfer of indium phosphide layers via adhesive wafer bonding and ion-cutting process

TitleDouble-flip transfer of indium phosphide layers via adhesive wafer bonding and ion-cutting process
Publication TypeJournal Article
Year of Publication2007
AuthorsChen, W, Chen, P, Jing, Y, Lau, SS, Kuech, TF, Liu, JR, Wang, XM, Chu, WK
JournalApplied Physics Letters
Volume90
Date PublishedJan
DOI10.1063/1.2450665